Ausschreibung "Resist-Simulations-Software"

Öffentliche Ausschreibung

Resist-Simulations-Software

Gegenstand der Ausschreibung

The subject of this tender is a software for the simulation of the imaging process in optical micro-lithography. The software shall be modular so that different aspects of the imaging of microstructures in photoresist can be considered. Depending on the requirements, the simulations will be performed in 2D for the aerial image or in 3D for the intensity distribution in the photoresist (bulk image) and the corresponding resist profile after development. By varying the input parameters of the simulations such as exposure dose and focus or the layer thickness of photoresist and antireflection coating (ARC), the process windows and optimal process parameters or layer thicknesses can be determined by displaying the results in e.g. bossing plots or swing curves. Furthermore, it should be possible to automatically optimize limited areas of mask layouts using a model-based optical nearfield correction (model-based OPC) in order to achieve a higher imaging fidelity.

Art des Auftrags

Lieferauftrag

Erfüllungsort (Bundesland):

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Auftraggeber

01109 Dresden

Eintragsdatum: 10.11.2023
Angebotsfrist: 10.12.2023